2024 IC Packaging Fair

Focusing on IC design companies and OSAT, combining existing resources, i.e. OEM/EMS of electronic manufacturing service providers, ODM, OBM of electronic brands, highly integrated industry through the concept of IC Packaging + PCBA, leading the development trend of advanced packaging industry; focusing on IC software, packaging test equipment, materials, automated production, and packaging test services;

The exhibition area will attract core buyers from 5G, IoT, wireless communication, automotive electronics, medical electronics, computer, military electronics, and other industries' packaging and testing businesses, semiconductor design companies, electronic product design solution companies, and electronic brand OBMs. 

The fair attracts over 2,000 trade visitors from East and South China, covering more than 250 semiconductor packaging and testing factories and EMS factories specializing in SIP manufacturing.

There is a concurrent Semiconductor Packaging and Testing Factory Business Matching Exhibition Area, aiming to connect semiconductor packaging and testing factories with domestic chip design manufacturers as well as automotive electronics and display chip, and module design manufacturers.

The Semiconductor Technology Conference (featuring a technical forum and industry dialogue) is organized in collaboration with leading semiconductor industry organizations at home and abroad, bringing together industry leaders and corporate executives to foster extensive technical exchanges and explore business opportunities.

Monthly reports on the upgrading and procurement demands of semiconductor testing and packaging factories in East and South China are collected and shared to facilitate efficient business matching and successful transactions between suppliers and buyers

Semiconductor Packaging Conference

Session 1: SiP and Advanced Packaging Session

Sub-forum II: Compound Semiconductor Packaging Sub-forum