NEPCON ASIA running man team is devoted to help you get in touch with exhibitors in the hassle-free way even if you are visiting us remotely.

Just click and join the meeting room of each exhibition segment (i,e, SMT and EMA.), our staff, as the host, will bring the camera right to the wanted exhibitor booth. Simple like this.

Based on your own schedule, NEPCON Online business matching will find and recommend the most suitable meeting times and locations for you.

New meetings will be automatically -synchronized with your existing meetings and you will never need to worry about clashes in your diary. There is no need to download any software. You can use NEPCON Online business matching by simply registering on the website.

30 senior executives from the electronics manufacturing industry’s equipment and technology will be interviewed by EM LEADER TV to talk about the future trends and visions of the electronics manufacturing industry.  In just 10 minutes of conversation, they will share their understanding of the bottlenecks in the industry, their interpretation of the current hot technologies and their insights into the future direction of the industry!

IC Packaging Fair 2022 will feature SiP and advanced packaging production demonstration lines. The forum will invite well-known domestic and international IC design companies, packaging and testing majors, and leading suppliers to share specific difficult and hot technical topics such as system-level packaging technology difficulties, heterogeneous integration, as well as supporting solutions and market trends.

IC Packaging Fair 2022 Semiconductor Packaging Fair will be held at the same time. A wafer level fan-out packaging production demonstration line will be launched. The forum will invite IC manufacturers, brands, well-known suppliers, research institutions and industry senior media to share the status and application of power semiconductor device packaging technology, device and material innovation, and the challenges facing specific application industries.