how Date: November 6th-8th 2024
Venue: Shenzhen World Exhibition & Convention Center (Baoan)
Opening Hours:
Wednesday, November 6th 9:30 AM-5:00 PM
Thursday, November 7th 9:00 AM-5:00 PM
Friday, November 8th 9:00 AM-3:30 PM
how Date: November 6th-8th 2024
Venue: Shenzhen World Exhibition & Convention Center (Baoan)
Opening Hours:
Wednesday, November 6th 9:30 AM-5:00 PM
Thursday, November 7th 9:00 AM-5:00 PM
Friday, November 8th 9:00 AM-3:30 PM
NEPCON ASIA serves as a vital sales channel and strategic partner for electronic manufacturing solution providers seeking to cultivate new business opportunities, engage with fresh clients, and secure new orders. With participation from over 60,000 domestic and international buyers in Asia's semiconductor packaging, testing, and other diverse application industries, the exhibition offers a comprehensive display of cross-industry electronic manufacturing solutions for global PCB assembly, semiconductor manufacturing, smart factories, automobile manufacturing, and touch display markets.
Positioned as a dynamic industry platform, NEPCON ASIA facilitates collaboration and exchanges among established and potential partners throughout the entire industrial chain and plays a pivotal role in enhancing the global competitiveness of Asian electronics manufacturing companies.
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● Focus on innovative equipment, materials, and solutions in SMT surface mounting, testing and measurement, welding, dispensing and spraying, electronic manufacturing services, electronic manufacturing automation, printed circuit boards, and electronic materials.
● Feature exciting and interactive activities such as the SMTA South China Technology and Equipment Conference, innovation skill competitions in popular application industries.
● Focus on the IGBT & SiC Manufacturing demonstration line, covering the entire production line chain from materials, design, and process to equipment, showcasing the latest technologies, products, and solutions in the industry.
● Discuss the latest technologies and developments in Advanced Wafer Fabrication, SIP & Advanced Packaging, and Compound Semiconductor Packaging.
● Feature a combination of lighthouse factory visit, exhibitions and high-end conferences.
● Launch the Exclusive Luncheon for Executives, creating a zero-distance communication platform.
● Host a series of forums, focusing on technologies and solutions, such as warehousing, high-growth industry applications, industrial robots, Internet of Things, and automation management.
● Overseas supply-demand matchmaking meeting that will feature over 2,000 overseas procurement delegations.
● A series of Country Day program and technical seminars will deepen understanding of domestic and overseas markets and policies.
Hosted by:
China Council for the Promotion of International Trade, Electronic Information Industry Sub-Council
Reed Exhibitions
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